Silicon (metal)

Machine has been set to 12,5 daN and 30 minutes. After the grinding time is finished, exactly 90 % of sample is able to pass a test sieve with 160 µm mesh. For a better fineness, longer grinding times are possible.

Second sample has been ground equally to result 1. A grinding set made of sintered corundum has been used for this.

After 30 minutes, already 87 % of sample is able to pass a 160 µm mesh test sieve. Longer grinding times are possible to improve the result.

With sintered corundum, we are guessing that you will find most abrasion (Al2O3) in your ground silicon sample.

With hardmetal tungsten carbide, a fineness of 92 % < 160 µm has been achieved after 30 minutes.

Still longer grinding times are possible to improve the grinding result.